Co-Building Agreement (8K)
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CO-BUILDING AGREEMENT (SUMMARY ENGLISH TRANSLATION)
Date: April 17, 2003
Parties:
Advanced Semiconductor Engineering Inc. ("Party A")
and
Hung Ching Development & Construction Co., Ltd. ("Party B")
Whereas, Party A will provide the land and mandate Party B as the real estate
contractor to build an Intellectual Factory/Office Building ("Building"). Both
parties entered into a Honlai Factory Investment and Construction Contract
("Contract"). Pursuant to Article 3 of the Contract, both parties agree to enter
into this Co-Building Agreement ("Agreement") and agree as follows:
1. Target of Co-Building
Party A will provide a leased parcel of land (land register Nos. 669, 670,
671, 672, 673, 674 and 675, Sub-section 2, Hoping Section, Nantze Section),
with an area of 15,511 square meters and Party B will fund and build a
factory/office building with 10 stories above the ground and 1 story
beneath the ground and a parking building with 13 stories above the ground.
2. Responsibility of Construction
(1) Party B shall retain an architect to design the Building who shall be
responsible for applying construction licenses and building
registrations.
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